ABSTRACT & BIOGRAPHY
Chip Embedded Power Package Technologies for AI and Vehicles
Abstract:
In the field of semiconductor power packaging, wiring resistance and inductance have become a major concern for increasing power and switching frequency. Especially in AI/Data Center and EV applications, package inductance has a critical impact on power integrity, switching noise generation and switching uniformity. This power integrity also affects signal integrity and ultimately degrades processor chip performance in AI/Data Center application. Chip-embedded packages have attracted much attention in recent years as a promising solution to these issues. This course will introduce the development history, technical features, and development roadmap of the chip-embedded power package, in particular the panel-level package for AI/Data Center and EV.
Biography:
Yoshiaki Aizawa is Corporate Technical Director at AOI Electronics. He is also Head of Advanced Packaging Development & Engineering Division. He has 40 years of experience in the semiconductor industry. He started at TOSHIBA as an opto-semiconductor product and application engineer. From 2003, he worked as Head of Advanced Integrated Device Development Department and from 2015, he worked as President of TOSHIBA Semiconductor Thailand. He joined AOI Electronics in 2020. He is currently a board member of AOI Electronics and is also developing chip embedded power package, RDL-first RF package and chiplet integrated package using panel format.
